STATS ChipPAC

STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication.

STATS ChipPAC Pte. Ltd., together with its subsidiaries, provides semiconductor packaging design, bump, probe, assembly, test, and distribution services for communication, consumer, and computing markets. Its services include post wafer fab process, and back-end assembly and test; document library; and package design center services for customers to determine the optimum package for complex integrated circuits.