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2001
Company Description
Lamina specializes in making chips for telecommunications equipment.
Lamina Ceramics employs proprietary technology to bond unfired ceramic to metal for use in communication and electronic components and packaging. Lamina's Low Temperature Co-Fired Ceramics on Metal (LTCC-M) technique offer component designers new opportunities to improve thermal performance, build larger components, speed assembly, limit shrinkage and gain many other advantages. The company's technology is based on decades of development at Sarnoff Corporation and its funding comes from Morgenthaler, a leading national venture capital fund.
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Manufacturer:
Hardware -
Formed:
2001 -
Company Website:
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Company E-mail:
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Company Address:
120 Hancock LaneWesthampton Beach, NYUnited States -
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