• 2000

Company Description

Aceris 3D Inspection develops flip chip and wafer inspection equipment for detecting measurements and defects.

Aceris 3D Inspection Inc. designs and manufactures flip chip and wafer inspection equipment for detecting measurements and defects. Its equipment is used to detect solder paste, singulated dies, warpage, epoxy, and bump height, as well as coined, round, and wafer level bumps. Aceris 3D Inspection Inc. was formerly known as Abante Inspection Inc. and changed its name to Aceris 3D Inspection Inc. in 2001. The company was founded in 2000 and is based in Montreal, Canada.